Clean up spec file for packaging 1.0 2.0alpha 2.0alpha-wayland 1.0_branch accepted/2.0/20130306.223555 accepted/2.0alpha-wayland/20121108.021056 accepted/2.0alpha/20121108.024103 accepted/trunk/20121010.014742 submit/2.0/20130306.222928 submit/2.0alpha-wayland/20121108.020805 submit/2.0alpha/20121108.020756 submit/trunk/20121010.014808 tizen/20120530.1
authorYang Lin <lin.a.yang@intel.com>
Wed, 30 May 2012 03:23:31 +0000 (11:23 +0800)
committerYang Lin <lin.a.yang@intel.com>
Wed, 30 May 2012 03:23:31 +0000 (11:23 +0800)
packaging/mkdevnodes.changes
packaging/mkdevnodes.spec

index e92a2a8..75936fe 100644 (file)
@@ -1,3 +1,6 @@
+* Wed May 30 03:17:39 UTC 2012 - Lin Yang <lin.a.yang@intel.con> - 0.2
+- Clean up spec file for packaging
+
 * Fri May 04 2012 Lin Yang <lin.a.yang@intel.com>
 - test release infrastructure
 
index 3dd1dac..ad005da 100644 (file)
@@ -7,7 +7,7 @@ Version:    0.2
 Release:    1
 Group:      Applications/System
 License:    GPLv2
-Source0:    mkdevnodes-%{version}.tar.gz
+Source0:    %{name}-%{version}.tar.bz2
 
 
 %description