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(parent: 30ed6bc) | patch
Clean up spec file for packaging 1.0 2.0alpha 2.0alpha-wayland 1.0_branch accepted/2.0/20130306.223555 accepted/2.0alpha-wayland/20121108.021056 accepted/2.0alpha/20121108.024103 accepted/trunk/20121010.014742 submit/2.0/20130306.222928 submit/2.0alpha-wayland/20121108.020805 submit/2.0alpha/20121108.020756 submit/trunk/20121010.014808 tizen/20120530.1
authorYang Lin <lin.a.yang@intel.com>
Wed, 30 May 2012 03:23:31 +0000 (11:23 +0800)
committerYang Lin <lin.a.yang@intel.com>
Wed, 30 May 2012 03:23:31 +0000 (11:23 +0800)
commitd7b0fe6a1f8f824d711f8c905b2a02df3e80c49e
tree8af084604f1dc68e7b3f44f962344c56ce72a229tree | snapshot
parent30ed6bc3d8090d247ef5dfb54d4b7ad59dac374fcommit | diff
Clean up spec file for packaging
packaging/mkdevnodes.changes diff | blob | history
packaging/mkdevnodes.spec diff | blob | history
Domain: System / Uncategorized;