packaging: Bump up to 1.5.0
authorduna.oh <duna.oh@samsung.com>
Mon, 20 Feb 2023 14:27:22 +0000 (23:27 +0900)
committerJihoon Kim <jihoon48.kim@samsung.com>
Thu, 21 Dec 2023 23:46:50 +0000 (08:46 +0900)
Change-Id: Ifaf29101d3d2f2d8f588aa2c3c36d8462e3b544e

packaging/libxkbcommon.spec

index b0d5af0..bfd57cb 100644 (file)
@@ -1,5 +1,5 @@
 Name:           libxkbcommon
-Version:        1.3.1
+Version:        1.5.0
 Release:        0
 License:        MIT
 Summary:        Wayland libxkbcommon library