packaging: Bump up to 1.5.0
authorduna.oh <duna.oh@samsung.com>
Mon, 20 Feb 2023 14:27:22 +0000 (23:27 +0900)
committerJihoon Kim <jihoon48.kim@samsung.com>
Thu, 21 Dec 2023 23:46:50 +0000 (08:46 +0900)
commit5be88a2e364914b35043f46ca09a4c8ba65992bf
treecd9bd14ceabe2a09fc2996c449f3f2a659858e4e
parent1608c9d4a753e66c7e46dc2a5be69079470ec75b
packaging: Bump up to 1.5.0

Change-Id: Ifaf29101d3d2f2d8f588aa2c3c36d8462e3b544e
packaging/libxkbcommon.spec