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Clean up spec file for packaging 1.0 2.0 2.0alpha 2.0alpha-wayland 1.0_branch accepted/2.0/20130306.223855 accepted/2.0/20130326.203813 accepted/2.0alpha-wayland/20121108.021029 accepted/trunk/20121010.014730 submit/2.0-panda/20130222.211027 submit/2.0/20130306.222933 submit/2.0/20130326.210829 submit/2.0alpha-wayland/20121108.022434 submit/trunk/20121010.013842 tizen/20120530.1
authorYang Lin <lin.a.yang@intel.com>
Wed, 30 May 2012 09:09:34 +0000 (17:09 +0800)
committerYang Lin <lin.a.yang@intel.com>
Wed, 30 May 2012 09:09:34 +0000 (17:09 +0800)
packaging/mobile-broadband-provider-info.changes patch | blob | history

diff --git a/packaging/mobile-broadband-provider-info.changes b/packaging/mobile-broadband-provider-info.changes
index 927987c..ff1990e 100644 (file)
--- a/packaging/mobile-broadband-provider-info.changes
+++ b/packaging/mobile-broadband-provider-info.changes
@@ -1,3 +1,6 @@
+* Wed May 30 03:17:39 UTC 2012 - Lin Yang <lin.a.yang@intel.con> - 20110511
+- Clean up spec file for packaging
+
 * Fri May 25 16:52:47 UTC 2012 - tu.c.truong@intel.com
 - Initial commit to Gerrit
 
Domain: Network & Connectivity / Uncategorized;