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Packaging: upgrade to 1.17.0
author
Sung-Jin Park
<sj76.park@samsung.com>
Mon, 25 Mar 2019 05:12:40 +0000
(14:12 +0900)
committer
Junkyeong Kim
<jk0430.kim@samsung.com>
Thu, 16 Feb 2023 10:09:13 +0000
(19:09 +0900)
Change-Id: Ibba67b9352bf634e229dbda9766a2542e3cad9ce
Signed-off-by: Sung-Jin Park <sj76.park@samsung.com>
packaging/wayland.spec
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diff --git
a/packaging/wayland.spec
b/packaging/wayland.spec
index
2f69b81
..
86be537
100644
(file)
--- a/
packaging/wayland.spec
+++ b/
packaging/wayland.spec
@@
-1,7
+1,7
@@
%define EGL_PACKAGE 0
Name: wayland
-Version: 1.1
5
.0
+Version: 1.1
7
.0
Release: 0
Summary: Wayland Compositor Infrastructure
License: MIT