packaging: Build PIE executables to allow address space randomization 44/264644/1 accepted/tizen_6.5_unified accepted/tizen_7.0_unified accepted/tizen_7.0_unified_hotfix accepted/tizen_8.0_unified accepted/tizen_unified tizen tizen_6.5 tizen_7.0 tizen_7.0_hotfix tizen_8.0 accepted/tizen/6.5/unified/20211029.015300 accepted/tizen/7.0/unified/20221110.061349 accepted/tizen/7.0/unified/hotfix/20221116.111521 accepted/tizen/8.0/unified/20231005.095631 accepted/tizen/unified/20210928.125307 submit/tizen/20210927.154141 submit/tizen_6.5/20211028.163901 tizen_6.5.m2_release tizen_7.0_m2_release tizen_8.0_m2_release
authorKarol Lewandowski <k.lewandowsk@samsung.com>
Mon, 27 Sep 2021 15:25:00 +0000 (17:25 +0200)
committerKarol Lewandowski <k.lewandowsk@samsung.com>
Mon, 27 Sep 2021 15:25:00 +0000 (17:25 +0200)
Change-Id: I68b125221c47d5c3cfd25041936154dfa57d6c82

packaging/usbutils.spec

index 755871a..3364870 100644 (file)
@@ -22,6 +22,7 @@ USB bus.
 cp %{SOURCE1001} .
 
 %build
+CFLAGS="-fPIC" LDFLAGS="-pie" \
 %reconfigure \
     --datadir=%{_datadir}/hwdata \
     --disable-usbids