packaging: Bump up to 1.1.6 accepted/tizen_6.5_base accepted/tizen_7.0_base accepted/tizen_7.0_base_hotfix accepted/tizen_8.0_base accepted/tizen_base accepted/tizen_base_dev accepted/tizen_base_riscv accepted/tizen_unified sandbox/jeon/upgrade tizen tizen_6.5_base tizen_7.0_base tizen_7.0_base_hotfix tizen_8.0_base accepted/tizen/6.5/base/20211028.055833 accepted/tizen/7.0/base/20221116.025755 accepted/tizen/7.0/base/hotfix/20221116.055203 accepted/tizen/8.0/base/20231005.044941 accepted/tizen/base/20210825.055310 accepted/tizen/base/20221115.103632 accepted/tizen/base/dev/20230602.080714 accepted/tizen/base/riscv/20231123.094522 accepted/tizen/unified/20210111.024859 submit/tizen/20210107.083851 submit/tizen_6.5_base/20211028.134301 submit/tizen_base/20210725.075107 submit/tizen_base/20210825.034957 tizen_6.5.m2_release tizen_7.0_m2_release tizen_8.0_m2_release
authorjeon <jhyuni.kang@samsung.com>
Thu, 7 Jan 2021 11:43:22 +0000 (20:43 +0900)
committerjeon <jhyuni.kang@samsung.com>
Thu, 7 Jan 2021 11:43:22 +0000 (20:43 +0900)
commit11838823f7ff50cbc2914ca26192eef617b24cbc
tree82b23814b1ecdedc4c4941c3f323867fb8d5c2b4
parent2e5534677cffebdd9447170360642f10301bed76
packaging: Bump up to 1.1.6
packaging/mtdev.spec