From 11838823f7ff50cbc2914ca26192eef617b24cbc Mon Sep 17 00:00:00 2001
From: jeon <jhyuni.kang@samsung.com>
Date: Thu, 7 Jan 2021 20:43:22 +0900
Subject: [PATCH] packaging: Bump up to 1.1.6

---
 packaging/mtdev.spec | 2 +-
 1 file changed, 1 insertion(+), 1 deletion(-)

diff --git a/packaging/mtdev.spec b/packaging/mtdev.spec
index 2066ea4..d6d1fe0 100644
--- a/packaging/mtdev.spec
+++ b/packaging/mtdev.spec
@@ -1,5 +1,5 @@
 Name:           mtdev
-Version:        1.1.5
+Version:        1.1.6
 Release:        0
 License:        MIT
 Summary:        Multitouch Protocol Translation Library
-- 
2.7.4