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packaging: Bump up to 1.10.0 accepted/tizen_6.5_unified sandbox/jeon/upgrade tizen_6.5 tizen_bkup_20220207 accepted/tizen/6.5/unified/20211029.013533 accepted/tizen/unified/20210111.024905 submit/tizen/20210107.083851 submit/tizen_6.5/20211028.163501 tizen_6.5.m2_release
authorjeon <jhyuni.kang@samsung.com>
Wed, 6 Jan 2021 07:00:34 +0000 (16:00 +0900)
committerjeon <jhyuni.kang@samsung.com>
Wed, 6 Jan 2021 07:00:34 +0000 (16:00 +0900)
packaging/libevdev.spec patch | blob | history

diff --git a/packaging/libevdev.spec b/packaging/libevdev.spec
index c6bd55a..e96bc87 100644 (file)
--- a/packaging/libevdev.spec
+++ b/packaging/libevdev.spec
@@ -1,5 +1,5 @@
 Name:           libevdev
-Version:        1.8.0
+Version:        1.10.0
 Release:        0
 License:        MIT
 Summary:        wrapper library for evdev input devices
Domain: Graphics System / Input Management;