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Package version up to 3.0.6
33/307233/1
accepted/tizen/unified/20240307.171849
author
Changyeon Lee
<cyeon.lee@samsung.com>
Wed, 6 Mar 2024 07:32:41 +0000
(16:32 +0900)
committer
Changyeon Lee
<cyeon.lee@samsung.com>
Wed, 6 Mar 2024 07:32:41 +0000
(16:32 +0900)
Change-Id: Iec0fc9dfcb53e0958e95927c5108b06bed98f476
packaging/hal-backend-tbm-vigs.spec
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a/packaging/hal-backend-tbm-vigs.spec
b/packaging/hal-backend-tbm-vigs.spec
index
29dcd2e
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4a189da
100644
(file)
--- a/
packaging/hal-backend-tbm-vigs.spec
+++ b/
packaging/hal-backend-tbm-vigs.spec
@@
-1,5
+1,5
@@
Name: hal-backend-tbm-vigs
-Version: 3.0.
5
+Version: 3.0.
6
Release: 1
License: MIT
Summary: hal tbm backend module for vigs