packaging: Bump up to 1.10.0 accepted/tizen_6.5_unified sandbox/jeon/upgrade tizen_6.5 tizen_bkup_20220207 accepted/tizen/6.5/unified/20211029.013533 accepted/tizen/unified/20210111.024905 submit/tizen/20210107.083851 submit/tizen_6.5/20211028.163501 tizen_6.5.m2_release
authorjeon <jhyuni.kang@samsung.com>
Wed, 6 Jan 2021 07:00:34 +0000 (16:00 +0900)
committerjeon <jhyuni.kang@samsung.com>
Wed, 6 Jan 2021 07:00:34 +0000 (16:00 +0900)
commitace3df5617b1a398bc8a51e7ca4a20cad89e7be7
tree92a8174ca8498603f3a4d6f5aa3fb6b7de55c35c
parentc53b1679768bc0967321619c88dde5fce9c94ed8
packaging: Bump up to 1.10.0
packaging/libevdev.spec