Package version up to 3.0.6 33/307233/1 accepted/tizen/unified/20240307.171849
authorChangyeon Lee <cyeon.lee@samsung.com>
Wed, 6 Mar 2024 07:32:41 +0000 (16:32 +0900)
committerChangyeon Lee <cyeon.lee@samsung.com>
Wed, 6 Mar 2024 07:32:41 +0000 (16:32 +0900)
commit5c09e8fbc9e8e2f756d5eecaab331072906ec5c7
tree868a79c4c1cdee99c411ddc7e2e196e9a1281f5f
parent183214bb3595602c5beafbd09bd93c6e689cbf63
Package version up to 3.0.6

Change-Id: Iec0fc9dfcb53e0958e95927c5108b06bed98f476
packaging/hal-backend-tbm-vigs.spec