Clean up spec file for packaging 1.0 2.0 2.0alpha 2.0alpha-wayland 1.0_branch accepted/2.0/20130306.223855 accepted/2.0/20130326.203813 accepted/2.0alpha-wayland/20121108.021029 accepted/trunk/20121010.014730 submit/2.0-panda/20130222.211027 submit/2.0/20130306.222933 submit/2.0/20130326.210829 submit/2.0alpha-wayland/20121108.022434 submit/trunk/20121010.013842 tizen/20120530.1
authorYang Lin <lin.a.yang@intel.com>
Wed, 30 May 2012 09:09:34 +0000 (17:09 +0800)
committerYang Lin <lin.a.yang@intel.com>
Wed, 30 May 2012 09:09:34 +0000 (17:09 +0800)
commitca75f496aeeab3a31f45aaf57059c26f0e9fdbcf
tree6b67045dd98a8229f0b3f53d22756e07ef68a019
parentec1018e4d840810914efd0984d0e8bb7aa67f051
Clean up spec file for packaging
packaging/mobile-broadband-provider-info.changes