Bump package version to 4.35 77/286677/1 accepted/tizen_6.0_base accepted/tizen_6.0_base_tool accepted/tizen_6.5_base accepted/tizen_6.5_base_tool accepted/tizen_7.0_base accepted/tizen_7.0_base_tool accepted/tizen_8.0_base accepted/tizen_base accepted/tizen_base_tool tizen_6.0_base tizen_6.5_base tizen_7.0_base tizen_8.0_base tizen_base accepted/tizen/6.0/base/20230713.142947 accepted/tizen/6.0/base/tool/20230116.011831 accepted/tizen/6.5/base/20230714.002611 accepted/tizen/6.5/base/tool/20230116.011935 accepted/tizen/7.0/base/20230714.003019 accepted/tizen/7.0/base/tool/20230530.212953 accepted/tizen/8.0/base/20231005.044951 accepted/tizen/base/20230714.003423 accepted/tizen/base/tool/20230131.023941 submit/tizen_6.0_base/20230111.190949 submit/tizen_6.5_base/20230111.191428 submit/tizen_7.0_base/20230517.094129 submit/tizen_7.0_base/20230517.094141 submit/tizen_base/20230130.022210 tizen_8.0_m2_release
authorKrzysztof Jackiewicz <k.jackiewicz@samsung.com>
Wed, 11 Jan 2023 13:17:50 +0000 (14:17 +0100)
committerKrzysztof Jackiewicz <k.jackiewicz@samsung.com>
Wed, 11 Jan 2023 13:17:50 +0000 (14:17 +0100)
commit257d700afdd106ddbd0a677cc2f38b3ede04e12e
treeae2eefff899c64d662fb420d500260267c6ff147
parente8af167a5979a2784279a38c93d9721a22283d15
Bump package version to 4.35

Change-Id: Ic10905e4bdc8c3e5462f78a8758f2f1ca4564355
packaging/nspr.spec