Bump to make 4.3 18/268618/1 sandbox/jinwang.an/make-4.3_20211228 tizen_base submit/tizen_base/20211229.230721 submit/tizen_base/20211230.070229 submit/tizen_base/20220102.235827
authorJinWang An <jinwang.an@samsung.com>
Tue, 28 Dec 2021 06:42:27 +0000 (15:42 +0900)
committerJinWang An <jinwang.an@samsung.com>
Tue, 28 Dec 2021 06:44:35 +0000 (15:44 +0900)
commitd7b8bd3b5ce7aa099954eb801a3a98f0fd402212
tree0d0981aae000017316e1cdbeafe0b477c585ea74
parentb11e2699c7ec42e6d2fc0f4c940f14e7c89b3974
Bump to make 4.3

Change-Id: Iaa034d6d10214874ff13c8b7b4747930162b7c31
Signed-off-by: JinWang An <jinwang.an@samsung.com>
packaging/make.manifest [new file with mode: 0644]
packaging/make.spec [new file with mode: 0644]