packaging: Bump version to 15.0.7
authorDongkyun Son <dongkyun.s@samsung.com>
Wed, 8 Mar 2023 00:27:33 +0000 (09:27 +0900)
committerSlava Barinov <v.barinov@samsung.com>
Mon, 15 Jan 2024 12:59:03 +0000 (15:59 +0300)
commit054396c5159075f8488c6cd9a13dd1283275a37f
tree643f6f32df716d45525908bc9a751a6dd6c1cda7
parent6d045c0741352083d9a62a01288b2b041575f477
packaging: Bump version to 15.0.7

Change-Id: I14c24a8d27c0c85107eb77d20070162744f6433a
Signed-off-by: Dongkyun Son <dongkyun.s@samsung.com>
packaging/llvm.spec