Bump to libzypp 17.23.7 57/248557/1
authorDongHun Kwak <dh0128.kwak@samsung.com>
Mon, 30 Nov 2020 03:01:38 +0000 (12:01 +0900)
committerDongHun Kwak <dh0128.kwak@samsung.com>
Mon, 30 Nov 2020 03:01:38 +0000 (12:01 +0900)
commita2db245e83eac573eccf63eae498eec47ad71363
treeaa1c3f382496bc0b412903143648f9b6770eec57
parent420383e6a5f2a78fd37e289d12c637b441f4431d
Bump to libzypp 17.23.7

Change-Id: I174a1a02b64962235b5d9b03a7b5a06ff2d859f5
Signed-off-by: DongHun Kwak <dh0128.kwak@samsung.com>
packaging/Exclude_subdirectory.patch [new file with mode: 0644]
packaging/add_pie_compile_option.patch [new file with mode: 0644]
packaging/libzypp-rpmlintrc [new file with mode: 0644]
packaging/libzypp.manifest [new file with mode: 0644]
packaging/libzypp.spec [new file with mode: 0644]