packing: Bump up to 1.3.1
authorDuna Oh <duna.oh@samsung.com>
Mon, 7 Feb 2022 16:32:57 +0000 (01:32 +0900)
committerJihoon Kim <jihoon48.kim@samsung.com>
Thu, 21 Dec 2023 23:46:50 +0000 (08:46 +0900)
commit4e08273c7ea262fba0b2507b04cd1e21e01c0d5f
tree9dbda01fd5c89b37d2c85531dbca1fb29774805b
parent990262cb4558f6eb0fbb936b83c9cc72daa585a6
packing: Bump up to 1.3.1
packaging/libxkbcommon.spec