packaging: Bump up to 0.10.0
authorjeon <jhyuni.kang@samsung.com>
Fri, 21 Feb 2020 05:33:10 +0000 (14:33 +0900)
committerJihoon Kim <jihoon48.kim@samsung.com>
Thu, 21 Dec 2023 23:43:48 +0000 (08:43 +0900)
commit17f4405a946285abed8cd8faae90fc2db6a535c9
tree511402ba64c73f93c2ac1a2b812abb8526f9be67
parent09cef9ece135ff9e1d677704856b60f90a6b0b71
packaging: Bump up to 0.10.0

Change-Id: Ie73df143cb587d8ad545cd7023bc0518c1546c85
packaging/libxkbcommon.spec