packaging: Bump up to 1.22.0 tizen_work_20230126 accepted/tizen/unified/20230227.152727
authorduna.oh <duna.oh@samsung.com>
Fri, 27 Jan 2023 05:37:22 +0000 (14:37 +0900)
committerduna.oh <duna.oh@samsung.com>
Fri, 24 Feb 2023 06:08:35 +0000 (15:08 +0900)
commit315701cf0d8ed2475a853a2d778453c50aadd72d
treed1bce371660b2aecd057a06e1557565ee7e0440c
parentbf566bf766bed5b5e4e7f22e09c5e6849ca9513e
packaging: Bump up to 1.22.0
meson.build
packaging/libinput.spec