packaging: Bump version to 2.37
authorDongkyun Son <dongkyun.s@samsung.com>
Fri, 13 Jan 2023 11:49:06 +0000 (20:49 +0900)
committerDongkyun Son <dongkyun.s@samsung.com>
Tue, 5 Mar 2024 09:34:11 +0000 (18:34 +0900)
commit986a4ac543733e87f2ce784f82ad0313bbf243d6
treeb229f43f46af7aed76916c1863fdf07a98d862d0
parentae5a3e03d696c0733da37ede5b37408128a9f1da
packaging: Bump version to 2.37

- nss_dns: Remove remnants of IPv6 address mapping
- Remove ldd libc4 support

Change-Id: I3fa6c32891ca98867f8d73f77d171d60579b7919
Signed-off-by: Dongkyun Son <dongkyun.s@samsung.com>
packaging/glibc.spec