packaging: version bump
authorSlava Barinov <v.barinov@samsung.com>
Tue, 19 Nov 2019 10:59:16 +0000 (13:59 +0300)
committerDongkyun Son <dongkyun.s@samsung.com>
Wed, 3 May 2023 09:45:27 +0000 (18:45 +0900)
commite9cd0d100ea18bb9c60922ad9b24fdbff8493e2e
tree82f1e0d32dd2ed74d2ae83061ff3431cd647e0fe
parent9b9241443035f21b8ae5c41b37d6991650f9022e
packaging: version bump

Change-Id: Id27d126ac3d940e72645de8f3e6b0f81c10c04c5
Signed-off-by: Slava Barinov <v.barinov@samsung.com>
packaging/binutils-aarch64.spec
packaging/binutils-armv7hl.spec
packaging/binutils-armv7l.spec
packaging/binutils.spec