packaging: bump to 2.24.90
authorChanho Park <chanho61.park@samsung.com>
Thu, 16 Oct 2014 08:14:52 +0000 (17:14 +0900)
committerVyacheslav Barinov <v.barinov@samsung.com>
Mon, 16 Feb 2015 07:34:10 +0000 (10:34 +0300)
commit50c8a5160c5292ec7fbf1817960d58b15cb6fc5f
tree169107a5851638bdfa7ef9c24b274dded8df0802
parentdadef93096fd397c3acf2078bcf6b526ff4e0da4
packaging: bump to 2.24.90

Change-Id: I89d1ebb22ddd66970afcfd79050ebac9ca4e41bc
Signed-off-by: Chanho Park <chanho61.park@samsung.com>
packaging/binutils.changes
packaging/binutils.spec
packaging/cross-aarch64-binutils.spec
packaging/cross-arm-binutils.spec
packaging/cross-i386-binutils.spec
packaging/cross-x86_64-binutils.spec