packaging: bump to 2.25 accepted/tizen_3.0.2014.q4_common sandbox/vbarinov/2.25 tizen_3.0.2014.q4_common tizen_3.0.2015.q1_common accepted/tizen/3.0.2014.q4/common/20150226.105857 accepted/tizen/common/20150220.083123 accepted/tizen/mobile/20150220.131641 accepted/tizen/tv/20150220.125539 accepted/tizen/wearable/20150220.130119 submit/tizen/20150219.141802 submit/tizen_3.0.2014.q4_common/20150226.000000
authorVyacheslav Barinov <v.barinov@samsung.com>
Mon, 16 Feb 2015 07:36:14 +0000 (10:36 +0300)
committerVyacheslav Barinov <v.barinov@samsung.com>
Tue, 17 Feb 2015 07:26:35 +0000 (10:26 +0300)
commit464875f6086d4549a8ad2e46d68d44dbdfb803f5
tree6da9ce3680b0ad2f6b3c86274f380f2910a0341e
parent9d0064fce246c1150d55ae585cb9dedcba763566
packaging: bump to 2.25

termcap is now needed for build

Change-Id: I8ae587311b4e4fe5dc5d419f361b0fd3f944ee7c
Signed-off-by: Vyacheslav Barinov <v.barinov@samsung.com>
packaging/binutils.spec
packaging/cross-aarch64-binutils.spec
packaging/cross-arm-binutils.spec
packaging/cross-i386-binutils.spec