tizen: update specs after v2021.10 rebase and cleanup
authorMarek Szyprowski <m.szyprowski@samsung.com>
Tue, 16 Nov 2021 13:05:00 +0000 (14:05 +0100)
committerMarek Szyprowski <m.szyprowski@samsung.com>
Thu, 18 Nov 2021 12:56:44 +0000 (13:56 +0100)
commitef420b834218783f3a8d60ff70864340c734c539
tree6e82ea238888d884f2052e649f5feaf8f5a11786
parentbda8d11ee2db3c3a59c325698c85323628914a11
tizen: update specs after v2021.10 rebase and cleanup

Local, outdated copy of the dtc in tools/dtc has been removed, so the
specs need to be adjusted for this.

Signed-off-by: Marek Szyprowski <m.szyprowski@samsung.com>
packaging/u-boot-amlogic.spec
packaging/u-boot-rpi3-32b.spec
packaging/u-boot-rpi3.spec
packaging/u-boot-rpi4-32b.spec
packaging/u-boot-rpi4.spec