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(parent: 2e45927) | patch
script: tizen: sd_fusing_rpi3: increase a hal partition size to 256M
authorJaehoon Chung <jh80.chung@samsung.com>
Thu, 12 Aug 2021 02:55:05 +0000 (11:55 +0900)
committerMarek Szyprowski <m.szyprowski@samsung.com>
Tue, 16 Nov 2021 12:00:22 +0000 (13:00 +0100)
commitd07ac1faa48bcb1eece83aec47a5971d71b26e5f
tree7deb79ad4795dcfb5259835194c401f9b0e679d6tree | snapshot
parent2e459275fbfee262e98089b0c06bc0d883f67020commit | diff
script: tizen: sd_fusing_rpi3: increase a hal partition size to 256M

Increase a hal partition size from 64M to 256M.

Change-Id: I650f2a5f7d946a6d5b251d7c5682b78afa8dd78f
Signed-off-by: Jaehoon Chung <jh80.chung@samsung.com>
scripts/tizen/sd_fusing_rpi3.sh diff | blob | history
Domain: System / Kernel;