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(parent: 45194d2) | patch
scripts: tizen: sd_fusing: Use only part type from block device for fusing
authorSeung-Woo Kim <sw0312.kim@samsung.com>
Tue, 30 Mar 2021 02:14:30 +0000 (11:14 +0900)
committerMarek Szyprowski <m.szyprowski@samsung.com>
Tue, 16 Nov 2021 12:00:22 +0000 (13:00 +0100)
commit9cf6cb8dc95fe0a584ea6a8e17f9840a7a53ca43
treee13998c5b9f08efba2cb923b52e75f4b3dd41e04tree | snapshot
parent45194d2530a871ab69a9c27bb8c15d2965555a29commit | diff
scripts: tizen: sd_fusing: Use only part type from block device for fusing

Current block device parsing result gives both disk and part
types of block device and this can break parsing 1st partition
for "mmcblk1" case. Use only part type from block device for
fusing when flashing partition image.

Change-Id: I0ca393fd5ecd26d77939f16c9c412d00d18cb912
Signed-off-by: Seung-Woo Kim <sw0312.kim@samsung.com>
scripts/tizen/sd_fusing_rpi3.sh diff | blob | history
Domain: System / Kernel;