packaging: update version from 2021.10 to 2022.10
authorJaehoon Chung <jh80.chung@samsung.com>
Fri, 29 Jul 2022 00:38:50 +0000 (09:38 +0900)
committerJaehoon Chung <jh80.chung@samsung.com>
Tue, 17 Oct 2023 04:19:36 +0000 (13:19 +0900)
commit406f97f41fd878137b93f9dbe33a573d9ce49b6a
treee2a4be7dfe13ce44c9acb6453ce614541cc8c4a2
parentbbed9bd63a59c3d9bf6eb0685878f2806d125cac
packaging: update version from 2021.10 to 2022.10

Update version from 2021.10 to 2022.19.

Change-Id: I2d96f29a32de54a90f66348cf38a558b60447570
Signed-off-by: Jaehoon Chung <jh80.chung@samsung.com>
packaging/u-boot-amlogic.spec
packaging/u-boot-rpi3-32b.spec
packaging/u-boot-rpi3.spec
packaging/u-boot-rpi4-32b.spec
packaging/u-boot-rpi4.spec
packaging/u-boot.spec