Fix : Bonding complete event is sent twice. 12/207612/1 accepted/tizen/unified/20190611.050050 accepted/tizen/unified/20190612.111712 submit/tizen/20190610.063128 submit/tizen/20190611.064259 submit/tizen/20190612.015823
authorinjun.yang <injun.yang@samsung.com>
Tue, 7 May 2019 04:24:51 +0000 (13:24 +0900)
committerDoHyun Pyun <dh79.pyun@samsung.com>
Mon, 10 Jun 2019 04:27:28 +0000 (13:27 +0900)
commit4938aeb939b3cf8f80c3cc6da40c81c095c09a2d
tree107f37466ff4b50fd9ef247b024398ea3b45f268
parent51f699be6740725518ddf59cb6a5536e7fc62181
Fix : Bonding complete event is sent twice.

[Model] All
[BinType] AP
[Customer] OPEN

[Issue#] N/A
[Request] Internal
[Occurrence Version] N/A

[Problem] When DUT request LE pairing, bonding complete event generated twice.
[Cause & Measure] Callback invoked twice in "Pair" dbus callback and the property changed event.
 This patch will handle all bonding complete event in the property changed event.
[Checking Method] Request LE pairing

[Team] IoT Hub
[Developer] Injun Yang
[Solution company] Samsung
[Change Type] Specification change

* bluez patch required
cb38640b07e8be0d5589e42b12bdc2a7e9fad652

Change-Id: Ifeb59d23b62d0d0e6316f7faf3920bb346d02057
Signed-off-by: DoHyun Pyun <dh79.pyun@samsung.com>
bt-service/bt-service-device.c
bt-service/bt-service-event-receiver.c