submit/tizen/20160328.071605
object d23c6c12500d9d00476a6b0838ab97f3dacabb7a
authorHyeongsik Min <hyeongsik.min@samsung.com>
Mon, 28 Mar 2016 07:16:05 +0000 (16:16 +0900)
packaging: bump to 7.10.1