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packaging: Added '.gbs.conf' for partial build
2022-02-08 Jaechul Leepackaging: Added '.gbs.conf' for partial build
Signed-off-by: Jaechul Lee <jcsing.lee@samsung.com>
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2022-02-07 Jaechul Leearm: dts: bcm2711-rpi-4-b: Adds buttons for speaker...
Signed-off-by: Jaechul Lee <jcsing.lee@samsung.com>
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2022-02-07 Jaechul Leearm: dts: bcm2711-rpi-4-b: Adds respeaker 4mic nodes
Signed-off-by: Jaechul Lee <jcsing.lee@samsung.com>
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2022-02-07 Jaechul LeeARM: dts: bcm2711-rpi-4-b: Enable dt nodes for audio...
Signed-off-by: Jaechul Lee <jcsing.lee@samsung.com>
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2022-02-07 Jaechul LeeASoC: ac108: Fixes kernel bug message when starting...
Signed-off-by: Jaechul Lee <jcsing.lee@samsung.com>
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2022-02-07 Jaechul LeeASoC: ac108: Adds default 4channels mic volume
Signed-off-by: Jaechul Lee <jcsing.lee@samsung.com>
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2022-02-07 Jaechul LeeARM64: dts: bcm2710-rpi-3-b: Adds respeaker 4mic nodes
Signed-off-by: Jaechul Lee <jcsing.lee@samsung.com>
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2022-02-07 Jaechul LeeASoC: ac108: Adds ac108 codec and machine code
Signed-off-by: Jaechul Lee <jcsing.lee@samsung.com>
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2017-09-19 Jaechul LeeASoC: samsung: Fix invalid argument when devm_gpiod_get...
Signed-off-by: Jaechul Lee <jcsing.lee@samsung.com>
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2017-09-19 Jaechul LeeASoC: samsung: Use 'samsung-i2s' cpu_dai for dai_links
Signed-off-by: Jaechul Lee <jcsing.lee@samsung.com>
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2017-09-19 Jaechul LeeASoC: samsung: i2s: Use specific name for i2s dais
Signed-off-by: Jaechul Lee <jcsing.lee@samsung.com>
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2017-07-17 Jaechul LeeASoC: samsung: i2s: Support more resolution rates
Signed-off-by: Jaechul Lee <jcsing.lee@samsung.com>
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2017-01-19 Jaechul Leearm64: dts: exynos: Add TM2 touchkey node
Signed-off-by: Jaechul Lee <jcsing.lee@samsung.com>
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2017-01-18 Jaechul LeeInput: tm2-touchkey - add touchkey driver support for TM2
Signed-off-by: Jaechul Lee <jcsing.lee@samsung.com>
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