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2019-11-04	Jaechul Lee	ASoC: ac108: Adds ac108 codec and machine code Signed-off-by: Jaechul Lee <jcsing.lee@samsung.com>	commit \| commitdiff \| tree
2019-11-04	Jaechul Lee	ARM64: dts: bcm2710-rpi-3-b: Adds buttons for speaker... Signed-off-by: Jaechul Lee <jcsing.lee@samsung.com>	commit \| commitdiff \| tree
2019-11-04	Jaechul Lee	ARM64: config: tizen_bcmrpi3: Adds CONFIG_KEYBOARD_GPIO Signed-off-by: Jaechul Lee <jcsing.lee@samsung.com>	commit \| commitdiff \| tree
2019-11-04	Jaechul Lee	ARM64: tizen_bcmrpi3_defconfig: enable USB audio driver Signed-off-by: Jaechul Lee <jcsing.lee@samsung.com>	commit \| commitdiff \| tree
2019-11-04	Jaechul Lee	packaging: Added '.gbs.conf' for partial build Signed-off-by: Jaechul Lee <jcsing.lee@samsung.com>	commit \| commitdiff \| tree
2017-09-19	Jaechul Lee	ASoC: samsung: Fix invalid argument when devm_gpiod_get... Signed-off-by: Jaechul Lee <jcsing.lee@samsung.com>	commit \| commitdiff \| tree
2017-09-19	Jaechul Lee	ASoC: samsung: Use 'samsung-i2s' cpu_dai for dai_links Signed-off-by: Jaechul Lee <jcsing.lee@samsung.com>	commit \| commitdiff \| tree
2017-09-19	Jaechul Lee	ASoC: samsung: i2s: Use specific name for i2s dais Signed-off-by: Jaechul Lee <jcsing.lee@samsung.com>	commit \| commitdiff \| tree
2017-07-17	Jaechul Lee	ASoC: samsung: i2s: Support more resolution rates Signed-off-by: Jaechul Lee <jcsing.lee@samsung.com>	commit \| commitdiff \| tree
2017-01-19	Jaechul Lee	arm64: dts: exynos: Add TM2 touchkey node Signed-off-by: Jaechul Lee <jcsing.lee@samsung.com>	commit \| commitdiff \| tree
2017-01-18	Jaechul Lee	Input: tm2-touchkey - add touchkey driver support for TM2 Signed-off-by: Jaechul Lee <jcsing.lee@samsung.com>	commit \| commitdiff \| tree

Domain: System / Kernel;

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