From ebbff23b6a6c7b18322848924f6f1173d1194ea5 Mon Sep 17 00:00:00 2001
From: Sung-Jin Park <sj76.park@samsung.com>
Date: Fri, 20 Oct 2017 13:38:55 +0900
Subject: [PATCH] packaging: bump to 1.5.7

Change-Id: I377188db7c942f3be00a1faef156250c8873b38a
Signed-off-by: Sung-Jin Park <sj76.park@samsung.com>
---
 packaging/libevdev.spec | 2 +-
 1 file changed, 1 insertion(+), 1 deletion(-)

diff --git a/packaging/libevdev.spec b/packaging/libevdev.spec
index 70bedc9..5094598 100644
--- a/packaging/libevdev.spec
+++ b/packaging/libevdev.spec
@@ -1,5 +1,5 @@
 Name:           libevdev
-Version:        1.2.2
+Version:        1.5.7
 Release:        0
 License:        MIT
 Summary:        wrapper library for evdev input devices
-- 
2.34.1