From 167af66db3ea76163286be7678771c4c6ac31ba4 Mon Sep 17 00:00:00 2001
From: =?utf8?q?=EC=98=A4=ED=98=95=EC=84=9D/On-Device=20Lab=28SR=29/Staff?=
 =?utf8?q?=20Engineer/=EC=82=BC=EC=84=B1=EC=A0=84=EC=9E=90?=
 <hseok82.oh@samsung.com>
Date: Wed, 27 Nov 2019 10:06:17 +0900
Subject: [PATCH] [nncc/pkg] Release build for packaging (#9222)

Use release build for nncc packaging

Signed-off-by: Hyeongseok Oh <hseok82.oh@samsung.com>
---
 infra/packaging/build | 1 +
 1 file changed, 1 insertion(+)

diff --git a/infra/packaging/build b/infra/packaging/build
index a36d5e2..33c1638 100644
--- a/infra/packaging/build
+++ b/infra/packaging/build
@@ -87,6 +87,7 @@ REQUIRED_UNITS+=("tf2tflite" "tf2circle")
 # TODO Use "nncc configure" and "nncc build"
 cmake \
   -DCMAKE_INSTALL_PREFIX="${NNCC_INSTALL_PREFIX}" \
+  -DCMAKE_BUILD_TYPE=release \
   -DBUILD_WHITELIST=$(join_by ";" "${REQUIRED_UNITS[@]}") \
   ${EXTRA_OPTIONS[@]} \
   "${NNAS_PROJECT_PATH}/infra/nncc"
-- 
2.7.4