From 065ab3abf97a3f26fdd2e05bc6b09e41ced36826 Mon Sep 17 00:00:00 2001
From: =?utf8?q?Matti=20Lehtim=C3=A4ki?= <matti.lehtimaki@gmail.com>
Date: Sun, 7 May 2023 23:12:20 +0300
Subject: [PATCH] dt-bindings: thermal: tsens: Add compatible for MSM8226
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Qualcomm MSM8226 has tsens v0.1 block.

Signed-off-by: Matti Lehtimäki <matti.lehtimaki@gmail.com>
Reviewed-by: Krzysztof Kozlowski <krzysztof.kozlowski@linaro.org>
Reviewed-by: Luca Weiss <luca@z3ntu.xyz>
Signed-off-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Link: https://lore.kernel.org/r/20230507201225.89694-3-matti.lehtimaki@gmail.com
---
 Documentation/devicetree/bindings/thermal/qcom-tsens.yaml | 1 +
 1 file changed, 1 insertion(+)

diff --git a/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml b/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml
index d9aa54c11663..cc22d5a18d82 100644
--- a/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml
+++ b/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml
@@ -29,6 +29,7 @@ properties:
         items:
           - enum:
               - qcom,mdm9607-tsens
+              - qcom,msm8226-tsens
               - qcom,msm8916-tsens
               - qcom,msm8939-tsens
               - qcom,msm8974-tsens
-- 
2.34.1