From: Sung-Jin Park <sj76.park@samsung.com>
Date: Fri, 20 Oct 2017 04:38:55 +0000 (+0900)
Subject: packaging: bump to 1.5.7
X-Git-Tag: submit/tizen/20171110.012855^0
X-Git-Url: http://review.tizen.org/git/?a=commitdiff_plain;h=refs%2Fheads%2Ftizen_5.0;p=platform%2Fupstream%2Flibevdev.git

packaging: bump to 1.5.7

Change-Id: I377188db7c942f3be00a1faef156250c8873b38a
Signed-off-by: Sung-Jin Park <sj76.park@samsung.com>
---

diff --git a/packaging/libevdev.spec b/packaging/libevdev.spec
index 70bedc9..5094598 100644
--- a/packaging/libevdev.spec
+++ b/packaging/libevdev.spec
@@ -1,5 +1,5 @@
 Name:           libevdev
-Version:        1.2.2
+Version:        1.5.7
 Release:        0
 License:        MIT
 Summary:        wrapper library for evdev input devices