From: duna.oh <duna.oh@samsung.com>
Date: Thu, 20 Feb 2025 04:08:41 +0000 (+0900)
Subject: packaging: Bump up to 1.13.3
X-Git-Tag: accepted/tizen/unified/20250224.161828^0
X-Git-Url: http://review.tizen.org/git/?a=commitdiff_plain;h=refs%2Fheads%2Faccepted%2Ftizen_unified_x;p=platform%2Fupstream%2Flibevdev.git

packaging: Bump up to 1.13.3
---

diff --git a/packaging/libevdev.spec b/packaging/libevdev.spec
index 4d47a93..d6ed6c2 100644
--- a/packaging/libevdev.spec
+++ b/packaging/libevdev.spec
@@ -1,5 +1,5 @@
 Name:           libevdev
-Version:        1.13.1
+Version:        1.13.3
 Release:        0
 License:        MIT
 Summary:        wrapper library for evdev input devices