From: Adrian Szyndela <adrian.s@samsung.com>
Date: Thu, 17 Feb 2022 12:08:43 +0000 (+0100)
Subject: packaging: bump version to v0.24.0
X-Git-Tag: submit/tizen/20220713.022109~7
X-Git-Url: http://review.tizen.org/git/?a=commitdiff_plain;h=refs%2Fchanges%2F77%2F271277%2F1;p=platform%2Fupstream%2Fbcc.git

packaging: bump version to v0.24.0

Change-Id: Ifc55899f22eb3ae9e0b5b76e8eb41d15d19110e7
---

diff --git a/packaging/bcc-tools.spec b/packaging/bcc-tools.spec
index 11ae0c4b..f7d4dea6 100644
--- a/packaging/bcc-tools.spec
+++ b/packaging/bcc-tools.spec
@@ -1,5 +1,5 @@
 Name: bcc-tools
-Version: 0.21.0
+Version: 0.24.0
 Release: 0
 Summary: Tools for BPF-based Linux IO analysis, networking, monitoring
 License: Apache-2.0