From: Boram Park <boram1288.park@samsung.com>
Date: Fri, 6 Nov 2015 02:52:10 +0000 (+0900)
Subject: packaging: bump to 1.8.0
X-Git-Tag: submit/tizen/20151116.055554~2
X-Git-Url: http://review.tizen.org/git/?a=commitdiff_plain;h=fb70cbf2956ceeff062b82d834ca6203a76fc602;p=platform%2Fupstream%2Fweston.git

packaging: bump to 1.8.0

Change-Id: Ie2286efb95640e7e53ac962d061df0aee7467c16
---

diff --git a/packaging/weston.spec b/packaging/weston.spec
index 91b4ea56..1623068a 100644
--- a/packaging/weston.spec
+++ b/packaging/weston.spec
@@ -28,7 +28,7 @@
 %endif
 
 Name:           weston
-Version:        1.7.0
+Version:        1.8.0
 Release:        0
 Summary:        Wayland Compositor Infrastructure
 License:        MIT