From: Karol Lewandowski <k.lewandowsk@samsung.com>
Date: Fri, 24 Jan 2014 15:45:52 +0000 (+0100)
Subject: packaging: Bump version
X-Git-Tag: submit/kdbus-integration/20141211.130918~12
X-Git-Url: http://review.tizen.org/git/?a=commitdiff_plain;h=f07facda2e7ca4cc01b9fd626d7d57ec800a046c;p=platform%2Fcore%2Fsystem%2Fkdbus-bus.git

packaging: Bump version
---

diff --git a/packaging/kdbus-bus.spec b/packaging/kdbus-bus.spec
index ac33147..8a5a9d7 100644
--- a/packaging/kdbus-bus.spec
+++ b/packaging/kdbus-bus.spec
@@ -1,6 +1,6 @@
 Name:       kdbus
 Summary:    kdbus kernel module
-Version:    0.4
+Version:    0.5
 Release:    1
 Group:      Base/Device Management
 License:    GPL-2.0