From: Jihoon Kim <jihoon48.kim@samsung.com>
Date: Fri, 5 Jan 2024 04:53:26 +0000 (+0900)
Subject: packaging: Bump up to 1.13.1
X-Git-Tag: accepted/tizen/unified/20240111.074611~1
X-Git-Url: http://review.tizen.org/git/?a=commitdiff_plain;h=ed76d6980227d3b2549cc77732dca06d5e23afac;p=platform%2Fupstream%2Flibevdev.git

packaging: Bump up to 1.13.1

Change-Id: I0f76f2f6f916a8c48ef483ddbd4008b3db920093
Signed-off-by: Jihoon Kim <jihoon48.kim@samsung.com>
---

diff --git a/packaging/libevdev.spec b/packaging/libevdev.spec
index 1f1729e..f42f19f 100644
--- a/packaging/libevdev.spec
+++ b/packaging/libevdev.spec
@@ -1,5 +1,5 @@
 Name:           libevdev
-Version:        1.11.0
+Version:        1.13.0
 Release:        0
 License:        MIT
 Summary:        wrapper library for evdev input devices