From: jeon <jhyuni.kang@samsung.com>
Date: Fri, 21 Feb 2020 05:41:48 +0000 (+0900)
Subject: packaging: Bump up to 1.8.0
X-Git-Tag: submit/tizen/20210107.083851~1
X-Git-Url: http://review.tizen.org/git/?a=commitdiff_plain;h=c53b1679768bc0967321619c88dde5fce9c94ed8;p=platform%2Fupstream%2Flibevdev.git

packaging: Bump up to 1.8.0
---

diff --git a/packaging/libevdev.spec b/packaging/libevdev.spec
index 5094598..c6bd55a 100644
--- a/packaging/libevdev.spec
+++ b/packaging/libevdev.spec
@@ -1,5 +1,5 @@
 Name:           libevdev
-Version:        1.5.7
+Version:        1.8.0
 Release:        0
 License:        MIT
 Summary:        wrapper library for evdev input devices
diff --git a/tools/touchpad-edge-detector.c b/tools/touchpad-edge-detector.c
index 8472c27..9056f76 100644
--- a/tools/touchpad-edge-detector.c
+++ b/tools/touchpad-edge-detector.c
@@ -160,7 +160,7 @@ pid_vid_matchstr(struct libevdev *dev, char *match, size_t sz)
 static inline void
 dmi_matchstr(struct libevdev *dev, char *match, size_t sz)
 {
-	char modalias[PATH_MAX];
+	char modalias[PATH_MAX - 7];
 	FILE *fp;
 
 	fp = fopen("/sys/class/dmi/id/modalias", "r");