From: Greg Kroah-Hartman Date: Wed, 5 Nov 2014 19:42:48 +0000 (-0800) Subject: Merge tag 'iio-for-3.19a' of git://git.kernel.org/pub/scm/linux/kernel/git/jic23... X-Git-Tag: v4.14-rc1~6283^2~446 X-Git-Url: http://review.tizen.org/git/?a=commitdiff_plain;h=be61a0d78449f53519905640ac3a9f24c197cbaf;p=platform%2Fkernel%2Flinux-rpi.git Merge tag 'iio-for-3.19a' of git://git./linux/kernel/git/jic23/iio into staging-next Jonathan writes: First round of new drivers, features and cleanups for IIO in the 3.19 cycle. New drivers / supported parts * rockchip - rk3066-tsadc variant * si7020 humidity and temperature sensor * mcp320x - add mcp3001, mcp3002, mcp3004, mcp3008, mcp3201, mcp3202 * bmp280 pressure and temperature sensor * Qualcomm SPMI PMIC current ADC driver * Exynos_adc - support exynos7 New features * vf610-adc - add temperature sensor support * Documentation of current attributes, scaled pressure, offset and scaled humidity, RGBC intensity gain factor and scale applied to differential voltage channels. * Bring iio_event_monitor up to date with newer modifiers. * Add of_xlate function to allow for complex channel mappings from the device tree. * Add -g parameter to generic_buffer example to allow for devices with directly fed (no trigger) buffers. * Move exynos driver over to syscon for PMU register access. Cleanups, fixes for new drivers * lis3l02dq drop an unneeded else. * st sensors - renam st_sensors to st_sensor_settings (for clarity) * st sensors - drop an unused parameter from all the probe utility functions. * vf610 better error handling and tidy up. * si7020 - cleanups following merge * as3935 - drop some unnecessary semicolons. * bmp280 - fix the pressure calculation. --- be61a0d78449f53519905640ac3a9f24c197cbaf