From: jeon <jhyuni.kang@samsung.com>
Date: Wed, 6 Jan 2021 07:00:34 +0000 (+0900)
Subject: packaging: Bump up to 1.10.0
X-Git-Tag: accepted/tizen/6.5/unified/20211029.013533^0
X-Git-Url: http://review.tizen.org/git/?a=commitdiff_plain;h=ace3df5617b1a398bc8a51e7ca4a20cad89e7be7;p=platform%2Fupstream%2Flibevdev.git

packaging: Bump up to 1.10.0
---

diff --git a/packaging/libevdev.spec b/packaging/libevdev.spec
index c6bd55a..e96bc87 100644
--- a/packaging/libevdev.spec
+++ b/packaging/libevdev.spec
@@ -1,5 +1,5 @@
 Name:           libevdev
-Version:        1.8.0
+Version:        1.10.0
 Release:        0
 License:        MIT
 Summary:        wrapper library for evdev input devices