From: David S. Miller <davem@davemloft.net>
Date: Sat, 17 May 2014 02:29:17 +0000 (-0400)
Subject: Merge branch 'bond_stacked_vlans'
X-Git-Tag: v3.15-rc7~8^2~15
X-Git-Url: http://review.tizen.org/git/?a=commitdiff_plain;h=a8d0d8417c0bdc870d28afb83bc12e61a818efa3;p=platform%2Fkernel%2Flinux-exynos.git

Merge branch 'bond_stacked_vlans'

Vlad Yasevich says:

====================
Fixed stacked vlan usage on top of bonds

Bonding device driver now support q-in-q on top for bonds.  There are
a few issues here though.

First, when arp monitoring is used, bonding driver will not correctly
tag traffic if the source of the arp device was configured on top of
q-in-q.  It may also incorrectly pick the wrong vlan id if the ordering
of that upper devices isn't as expected (there is no guarntee on ordering).

Second, the alb/tlb may use what would be considered 'inner' vlans in
its learning announcements, as it simply announces all vlans configured
on top of the bond without regard for encapsulation/stacking.

This series fixes the above 2 issues.  This series also depends on the
functionality introduced in
	http://patchwork.ozlabs.org/patch/349766/

Since v1:
  - Changed how patch1 verifies the device path.  We no longer use the
    _all_upper version of the function.  We find the path and if it was
    found, then collect the vlan information.
  - Use the constant to devine maximum vlan nest level support on top
    of bonding.  This can be changed if 2 is too low.
  - Inlude patch2 into the series.
====================

Signed-off-by: David S. Miller <davem@davemloft.net>
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a8d0d8417c0bdc870d28afb83bc12e61a818efa3