From: Sunghyun Kim <scholb.kim@samsung.com>
Date: Fri, 29 May 2020 02:04:48 +0000 (+0900)
Subject: [TCSACR-298] Add new feature key to opengles.surfaceless_context
X-Git-Tag: submit/tizen/20200601.005816~1
X-Git-Url: http://review.tizen.org/git/?a=commitdiff_plain;h=8b7243233796f13c6f26c92740146e00007e4e29;p=tools%2Fbuilding-blocks.git

[TCSACR-298] Add new feature key to opengles.surfaceless_context

Change-Id: I64b827173ca463866ad5ba960b30eb95a73a5831
---

diff --git a/packaging/platform-preset-boards-rpi3.inc b/packaging/platform-preset-boards-rpi3.inc
index a90f6d9..75608dd 100644
--- a/packaging/platform-preset-boards-rpi3.inc
+++ b/packaging/platform-preset-boards-rpi3.inc
@@ -399,6 +399,8 @@ Requires:   dali-toolkit-resources_720x1280
 %description sub2-Preset_boards-RPI3-DALi
 Packages of DALi HAL and Feature for RPI3.
 %files sub2-Preset_boards-RPI3-DALi
+%posttrans sub2-Preset_boards-RPI3-DALi
+%tizen_feature tizen.org/feature/opengles.surfaceless_context true
 
 ### RPI3-EFL ###
 %package sub2-Preset_boards-RPI3-EFL