From: Adrian Szyndela <adrian.s@samsung.com>
Date: Fri, 18 Feb 2022 13:02:53 +0000 (+0100)
Subject: packaging: enable building for aarch64
X-Git-Tag: submit/tizen/20220713.022109~6
X-Git-Url: http://review.tizen.org/git/?a=commitdiff_plain;h=87cdac09f9a72acd20a2137e79aa4ffb38197d9f;p=platform%2Fupstream%2Fbcc.git

packaging: enable building for aarch64

Change-Id: Id8c602cb897c3223ee863d4d81d6f402f73ae188
---

diff --git a/packaging/bcc-tools.spec b/packaging/bcc-tools.spec
index f7d4dea6..313779fe 100644
--- a/packaging/bcc-tools.spec
+++ b/packaging/bcc-tools.spec
@@ -7,7 +7,6 @@ Vendor: None (open source)
 Group: Development/Compilers
 URL: https://github.com/iovisor/bcc
 Source0: %{name}-%{version}.tar.gz
-ExcludeArch: aarch64
 Requires: /sbin/ldconfig
 BuildRequires: gcc >= 3.4
 BuildRequires: cmake python3