From: Guenter Roeck <linux@roeck-us.net>
Date: Mon, 22 Apr 2019 17:12:32 +0000 (-0700)
Subject: hwmon: (max6650) Drop call to thermal_cdev_update
X-Git-Tag: v5.4-rc1~1101^2~3
X-Git-Url: http://review.tizen.org/git/?a=commitdiff_plain;h=212244f76d13bdbb57fa8096a8aa94c5b55c4be5;p=platform%2Fkernel%2Flinux-rpi.git

hwmon: (max6650) Drop call to thermal_cdev_update

The call to thermal_cdev_update() causes any fan connected to the chip
to stop immediately. If the thermal subsystem is not set up to actually
handle the chip as cooling device, the remains stopped until is is
restarted manually with a write to a sysfs attribute.

There is evidence that thermal_cdev_update() should only be called from
thermal governors, not from thermal cooling device drivers. Drop the call.

Cc: Jean-Francois Dagenais <jeff.dagenais@gmail.com>
Tested-by: Jean-Francois Dagenais <jeff.dagenais@gmail.com>
Signed-off-by: Guenter Roeck <linux@roeck-us.net>
---

diff --git a/drivers/hwmon/max6650.c b/drivers/hwmon/max6650.c
index e977c2f..9399532 100644
--- a/drivers/hwmon/max6650.c
+++ b/drivers/hwmon/max6650.c
@@ -801,8 +801,6 @@ static int max6650_probe(struct i2c_client *client,
 		dev_warn(&client->dev,
 			 "thermal cooling device register failed: %ld\n",
 			 PTR_ERR(data->cooling_dev));
-	else
-		thermal_cdev_update(data->cooling_dev);
 #endif
 	return 0;
 }