From: Neil Armstrong <neil.armstrong@linaro.org>
Date: Tue, 24 Jan 2023 11:39:08 +0000 (+0100)
Subject: arm64: dts: amlogic: meson-sm1-odroid-hc4: fix active fan thermal trip
X-Git-Tag: v6.1.21~1372
X-Git-Url: http://review.tizen.org/git/?a=commitdiff_plain;h=1c68c6006478d81b7d670f03e7a4acf401921ba9;p=platform%2Fkernel%2Flinux-starfive.git

arm64: dts: amlogic: meson-sm1-odroid-hc4: fix active fan thermal trip

[ Upstream commit 1d2f14117aa7773efff50f832b85fc7779e586e0 ]

Add an active trip tied to the on-board fan cooling device, which is better
than describing it along the passive cooling maps.

Fixes: 33b14f663df8 ("arm64: dts: meson: add initial device-tree for ODROID-HC4")
Reported-by: Ricardo Pardini <ricardo@pardini.net>
Link: https://lore.kernel.org/r/20230124-topic-odroid-hc4-upstream-fix-fan-trip-v1-1-b0c6aa355d93@linaro.org
Tested-by: Ricardo Pardini <ricardo@pardini.net>
[narmstrong: added Ricardo's tested-by from off-list chat]
Signed-off-by: Neil Armstrong <neil.armstrong@linaro.org>
Signed-off-by: Sasha Levin <sashal@kernel.org>
---

diff --git a/arch/arm64/boot/dts/amlogic/meson-sm1-odroid-hc4.dts b/arch/arm64/boot/dts/amlogic/meson-sm1-odroid-hc4.dts
index e3486f6..3d642d7 100644
--- a/arch/arm64/boot/dts/amlogic/meson-sm1-odroid-hc4.dts
+++ b/arch/arm64/boot/dts/amlogic/meson-sm1-odroid-hc4.dts
@@ -76,9 +76,17 @@
 };
 
 &cpu_thermal {
+	trips {
+		cpu_active: cpu-active {
+			temperature = <60000>; /* millicelsius */
+			hysteresis = <2000>; /* millicelsius */
+			type = "active";
+		};
+	};
+
 	cooling-maps {
 		map {
-			trip = <&cpu_passive>;
+			trip = <&cpu_active>;
 			cooling-device = <&fan0 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>;
 		};
 	};